ACE 100ml No Clean Soldering Liquid Flux has been designed for use in the electronic industry to improve effectiveness in dip and wave soldering of conventional PCB assemblies.
Process Considerations:-
- The flux needs to be pre-heated post application in order to activate it.
- Recommended temperature may be anywhere between 90˚C to 150˚C (194˚F to 302˚F) depending upon circuit board design, board thickness, length of contact time with molten solder, speed of solder flow and preheating time.
- Solder pot temperature should be set between 245- 260˚C (473-500˚F) for Sn63Pb37/Sn60Pb40 alloy and between 260-270˚C (500-518˚F) for SnCu/SnAgCu alloys.
- Please note that the above are only guidelines and the optimum settings for a given assembly may vary keeping in mind the above mentioned factors.
Cleaning:-
- Flux residues are non-corrosive and non-conductive, thus do not require removal in most applications. In case residue removal is required our PCB Cleaner may be used for the same.
Storage and Shelf Life:-
- It is flammable, thus must be stored in a cool and dry place away from all sources of ignition. Shelf life is indefinite at room temperature when stored properly.
